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Download Advanced millimeter-wave technologies : antennas, packaging by Duixian Liu; et al PDF

By Duixian Liu; et al

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Extra info for Advanced millimeter-wave technologies : antennas, packaging and circuits

Sample text

4 Emerging Packaging Technologies Packaging technologies are changing rapidly to adopt to emerging markets, innovation and technology. Many new acronyms and abbreviations are being created and details about the fabrication process are often proprietary to a specific vendor. This section reviews only exemplary emerging packaging technologies. 1 Microcoaxial Wirebonds – Bridgewave Microcoaxial wirebonds have demonstrated the ability to handle frequencies up to 100 GHz [37]. A coaxial connection with a regular wirebond is formed by the deposition of a dielectric and a final metal coating inside a standard low-cost package.

More details are available elsewhere in references [15–18] or Chapter 4. 1 MMICs Strictly speaking, a MMIC is not a packaging technology. In fact, MMIC technologies are an extension of the IC concept for microwave applications [20]. It refers to a combination of interconnected microwave circuit elements monolithically integrated on a single substrate. The package of a MMIC may be a metal housing or a plastic encapsulation, as will be seen later. While the first IC was invented by Jack Kilby back in July 1958 [21], the first MMIC was published about 20 years later by Ray Pengelly and James Turner in 1976 [19].

In a COB technology, the designer has the freedom to optimize the PCB footprint of the die within the design rules given by the board manufacture. 14 shows an example of such COB design rules. High-quality dielectrics such as glass-fiber reinforced Teflon materials are available. They can be laminated on top of PCB cores to improve the characteristic of microstrip interconnects. Critical, however, is the design of the fanout area around the die, where the space is limited to accommodate enough clearance to adjacent ground and signal conductors.

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