By Charles Pfeil
This ebook is for PCB designers who're designing forums with a number of very huge Ball Grid Array (BGA) programs. It explores the impression of dense BGAs with excessive pin-count on PCB layout and offers options for the inherent layout demanding situations. notwithstanding you'll no longer but were faced with the problems of routing BGAs and the effect on fabrication charges and sign integrity, this booklet will exhibit those power pitfalls in addition to how to mitigate those difficulties
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Additional resources for BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs
The extended buried via reduces the lamination and plating steps which lowers cost; however it reduces route density. 50 Chapter Three – HDI Stackups Stackup G Figure 3-18: Stackup G Stackup G Comments: • Total score =14 • The ground plane on the outer layers provides the high rating for power and signal integrity. • The extended buried via and the skip via reduces the lamination and plating steps which lowers cost; however it also reduces route density. 51 BGA Breakouts and Routing Any-Layer-Via Stackups The any-layer-via stackup is an HDI variation that although currently expensive will become affordable over time and in my opinion provide the kind of stackup and via models that will be required for successful routing of very large and very fine-pitch BGAs.
O Using stacked vias will allow for greater route density; however, the cost will be higher. 35 BGA Breakouts and Routing HDI Type IV, V, VI These additional HDI Types are defined in the IPC-2315 specification; however, they are not presented here simply because they are more expensive to fabricate and are probably not necessary for large dense PCBs with BGA breakout and routing challenges. Via Models HDI Type III accommodates numerous via models and spans. Ultimately the via model that suits your design best will be driven by finding the least expensive method that will still enable adequate route density within the constraints of signal integrity.
Micro-vias are staggered from other micro-vias and may be stacked or staggered relative to the buried vias. Additional Notes • See Type I note above on limiting the number of laminated core layers which applies to all variations of Type II through and buried vias. Figure 3-2: IPC Type II Figure 3-3: IPC Type II, variable-depth micro-vias The variable-depth micro-vias can be in the form of skip-vias that connect only on the start and end layers. 33 BGA Breakouts and Routing Figure 3-4: IPC Type II, stacked vias Recommendations • In the context of large dense boards with multiple high pin-count BGAs, this stackup is better than Type I; however, is not adequate for the more difficult designs.